Wafer Scale Package for High Power Devices

ABSTRACT

A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages arc mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction.

RELATED APPLICATIONS

The present application is based on and claims benefit of U.S.Provisional Application No. 60/753,353, filed Dec. 21, 2005, entitledBOND-WIRELESS HIGH POWER DENSITY MODULE WITH INTEGRATED SMARTNESS(IR-3174 Prov); U.S. Provisional Application No. 60/756,984, filed Jan.6, 2006, entitled BOND-WIRELESS POWER PACKAGE WITH INTEGRATED CURRENTSENSOR, ESPECIALLY SHORT CIRCUIT PROTECTION (IR-3175 Prov); andProvisional Application No. 60/761,722, filed Jan. 24, 2006, entitledSTRESS-REDUCED BOND-WIRELESS PACKAGE FOR HIGH POWER DENSITY DEVICES(I.R.-3177 Prov), to all of which a claim of priority is hereby made andthe disclosure of which is incorporated by reference.

FIELD OF THE INVENTION

This invention relates to semiconductor device packages and to processesfor their manufacture.

BACKGROUND OF THE INVENTION

The power and current carrying capabilities of power switches such asMOSFETs and IGBTs are commonly limited by their package. Thus, thepackage introduces thermal and electrical resistance that can causepower loss and corresponding heating of the semiconductor die beyond itsspecified limits.

Beside the thermal issues, package inductivity is also an importantlimiting factor for switching high currents. Parasitic packageinductance causes inductive over-voltage that can destroy the die. Suchdie may be silicon or GaN based die. This is especially true forstate-of the art packaging technologies using bond wires for theelectrical connection of the top-metals of the die to a lead frame orother external metal terminals. In order to take the inductiveovervoltage into account the die used often must have a much higherbreakdown voltage then the application itself would require.

Therefore, packaging technologies try to achieve low inductivity andbetter thermal connectivity to a heatsink by bond wireless connectiontechniques for the power devices. One example of such an approach is theDirectFET technology shown, for example, in U.S. Pat. No. 6,624,522(IR-1830). By connecting the topside of the power die particularly thesource or the emitter contact of a MOSgated device to a larger metalarea, the package gains a higher current carrying capability, betterthermal properties and a lower inductivity at the same time. (The toppower electrode with hereinafter frequently be referred to as the sourcefor both MOSFETs and IGBTs.) Other techniques use flip-chip soldering ofthe device or large metal straps are soldered on top of the die (sourceor emitter contact) in order to improve the thermal and electricalbehavior of the device.

A major problem of large metal contacts or copper straps is the stresson the die due to the higher thermal expansion coefficient of metalcompared to that of the die, such as a silicon based die. This may beacceptable in relatively moderate power applications as in consumerelectronics but it creates a severe reliability issue for heavy dutyapplications in a harsh environment like those of automotiveelectronics. The stress effect in such extreme applications can causemajor damage to the sensitive top metal layers of the die due to theactive layers underneath.

Besides the introduced stress on the die, large metal contacts such asthose used in a copper strap device or in the DirectFET device canmetal, can have another disadvantage on the long term behavior of thepackage. Thus, the solder joint between the die and the metal contacttends to deteriorate rapidly if major temperature changes and cyclingare applied. This failure mechanism is also driven by the thermalmismatch and the different thermal expansion of the metal contact vs.the die material. This results in micro cracks and even de-lamination ofthe contact, causing an increase of thermal and electrical resistancewithin the solder joint. Consequently, the package performance will beimpacted.

Therefore the metal can of the DirectFET device uses an adhesive layerrather than a solder for the die attach of the backside of the die tothe interior of the metal can in order to compensate the thermalexpansion mismatch between die and metal can. Adhesives can deal betterwith stress induced forces and do not deteriorate like solder due totheir higher flexibility. However, an adhesive or glue layer has limitedcurrent carrying capability and a higher thermal resistance as comparedto solder.

Due to the above described thermal mismatch problems high power packagescommonly use substrates like Direct-Bonded-Copper (DBC), which offers abetter match of the thermal expansion coefficient to die substrates suchas silicon. A DBC substrate generally comprises a central insulationlayer, frequently a ceramic which has top and bottom conductive layerson its top and bottom surfaces. These are frequently copper. The toplayer may be patterned as desired. This technology is normally used bysoldering one side of a die to the top conductive layer of DBC while theother side is contacted via conventional wire bonds. As far as coolingis concerned, only one side of the die is cooled, while the other sidesuffers from the thermal bottleneck of the wirebonds. Further, theinductance is relatively high due to the wirebonds, Therefore, whileDBC-substrate technology on one die side only solves the reliabilityproblem, does not offer the best thermal and low-inductance performance.

It is known to use two DBC substrates, forming a sandwich of a top and abottom DBC substrate and central die. The DBC substrates are relativelylarge since they also provide the whole circuitry for the power modulessuch as half-bridge-, H-bridge- or full-bridge configurations. Bare dieare soldered between the top and bottom DBC. Bond-wireless die attach,low inductivity and both-sided cooling is thus addressed. The maindisadvantage of these structures is the high cost of using two highlycustomized DBC substrates (since they provide the circuitry) which haveto be extremely precise and flat since several bare die of a thicknessof 100-300 μm need to be contacted between the substrates. This requiresextreme precision which is a major challenge for production. Therefore,the high costs and manufacturing challenges for such a DBC sandwichtechnology are major obstacles for this technique.

A further disadvantage of the prior art packages described above is thedifficulty of adding current sensing and over current sensing functionsto the package. Thus, it is known to implement current measurementsensors into the application of such packages. These sensors allow aprotection circuit to detect dangerous current limits and startcountermeasures such as shutting down a system, limiting the current,running the application at lower performance by derating current orvoltage and the like. These current sensors are normally resistors whichare mounted in a current path of the application. Such current sensorsintroduce additional costs and need mounting space. Current sensingcapabilities can also be added to the power device itself. Thus, currentsense are known MOSFETs in which a small part of the current carryingarea of the die is used to measure the current flow and determine, viacalibration techniques which are well known, the corresponding fullcurrent through the full active area of the device. The disadvantages ofthis method are:

-   -   it needs additional space on the die;    -   it is relatively inaccurate, and especially;    -   it requires a special die design/layout.

Another disadvantage regarding packaging of such current sensing powerdevices is that the current sense function needs at least two morecontact pads which deliver a voltage signal proportional to the maincurrent flow. These contacts are normally small low power pads connectedvia wire bonds to the external circuitry. Those contact pads reduce theavailable die surface further. Thus, the bond wireless power packagebecomes much more complex since two more small contacts need to becontacted, and bumping of the die becomes more complicated, too.

Another further disadvantage is the difficulty of testing/probing of diewith integrated current sense functions. The current sense option addstest time and can reduce the yield of the wafer to due failures of thecurrent sense cells.

However, motor drives, DC/AC—inverter or DC/DC converters using powerswitches in a half-, full- or H-bridge configuration need to measure andcontrol the current very precisely. It is important that thecorresponding control units get a precise feedback of the main current(e.g. the phase currents in a motor drive application). For thesepurposes sensors with relatively high accuracy are required (often overa large dynamic range), It is therefor to use highly precise shuntresistors, hall-sensors, magneto resistive sensors, and the like forthis kind of current sensing.

SUMMARY OF THE INVENTION

In accordance with the invention a novel high current package is formedin which a depression formed in the top copper layer forms a “case” toreceive a thinned semiconductor die such as a MOSFET or IGBT or thelike. The drain contact (drain and collector electrodes areinterchangably used herein) is soldered to the surface of the depressionand the top surface of the die is approximately coplanar with the rim ofthe depression. Solderable source (or emitter) and gate pads orcorresponding solder bumps project above the plane at the rim. The diecan also be flipped and mounted with the source (emitter) electrodesoldered to the depression bottom. The rim around the depression may beshaped as a horse shoe (or U-shaped) or can have any desired shape withor without an interrupted rim.

One or more such packages can be mounted on a heat sink, and pluralpackages may share a common central insulation layer. The packages canbe formed at the DBC card level and can be singulated individually or inintegral groups of packages.

A top heat sink may be connected to the top copper layer of one or morepackages to provide top side and thus dual side cooling.

One or more conductive vias may be formed through the DBC insulationlayer to permit connection of top die electrodes to the bottom DBCcopper layer to act as a resistive current shunt. An integrated circuitcontrol structure can be connected to the top of such packages for thecontrol of the devices in the circuits containing them.

The invention offers the following advantages:

-   -   a) improved mechanical properties:        -   i) stress-reduced both-sided cooled semiconductor device            housing        -   ii) material selection with thermally matching expansion            coefficients to silicon die        -   iii) increased reliability due to matching thermal expansion            coefficients    -   b) improved electrical and thermal properties:        -   i) low inductance by providing a large contact area for            source and drain (or emitter/collector) of the die        -   ii) excellent current power capability due to low electrical            and thermal resistance using solder die attach and large            contact areas        -   iii) electrical isolation (needed in high voltage and            automotive and other applications)    -   c) improved manufacturing and handling properties        -   i) pre-assembled discrete component package(s) suitable for            easy handling and integration into power modules        -   ii) less severe precision requirements for the DBC    -   d) low manufacturing and test costs due to:        -   i) a high volume production without application specific            customization, which can be done by the end-customer        -   ii) die attach to the DBC can depression can be done on a            DBC-card instead of handling and assembling discrete die        -   iii) electrical/parametric end-tests after or during            assembly can be done at DBC-card level before separating the            packaged parts into discrete devices        -   iv) transportation to the end-customer can be done by using            a DBC-card-assembly as a whole which offers protection            without the need for a sophisticated additional transport            package    -   e) unique customer advantages:        -   i) the pre-assembled discrete component package matches the            thermal expansion coefficient of known power substrates and            therefore is attractive for a large variety of applications        -   ii) application-flexibility of the packaged discrete devices            which can easily be combined to an application specific            circuitry by the end-customer        -   iii) application-flexibility due to various die attach            possibilities inside of the DBC-can such as like up-side            down or bottom up, providing optimum low-and high-side            driver or half-/full-bridge configurations just by combining            several DBC-can packaged die on a power substrate or in a            power module        -   iv) cost-effective material choice by matching the ceramic            type of the DBC-can to the application requirements (e.g.            Al₂O₃; AlN; SiN; and other ceramics)    -   f) unique easy implementation of optional features:        -   i) an additional EMI screening function is available using            the top-Cu layer of the DBC-can        -   ii) an additional heat-spreader can be mounted on top of the            DBC-can while the bottom of the die is soldered to the            cooled power substrate of the application giving highly            efficient double sided cooling for highest power densities        -   iii) easy contact or integration of “intelligent devices”            such as a gate-driver IC directly on top of the die package        -   iv) easy implementation of contact terminals for external            electrical interfaces such as power and signal leadframes    -   g) application benefits:        -   i) Due to the above described high flexibility of use and            due to different available options, the invention will be            able to cover a broad bandwidth of applications in the power            management market.        -   ii) The main application field will be in high power            circuits and modules switching high currents or high            voltages and requiring low inductance and EMI-screening.            Especially relevant are high power density applications            using MOSFETs and IGBTs and applications under harsh            environmental conditions or difficult temperature cycling            requirements like automotive or safety critical functions            with high reliability requirements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a package of the invention.

FIG. 2 is a cross-section of FIG. 1 taken across section line 2-2 inFIG. 1.

FIG. 3 is an exploded perspective view of FIGS. 1 and 2 and showsalternate orientations for the semiconductor die of the package.

FIGS. 4 and 4A are a top view of an alternative structures for thepackage of the invention.

FIG. 5 is a top view of a further alternative of the package of FIGS. 1,2 and 3 in which the die is inverted.

FIG. 6 is an exploded perspective view of the embodiment of FIG. 5.

FIG. 7 is a top view of a further embodiment of the invention in which aresistive shunt via is formed in the DBC substrate.

FIG. 8 is a cross-section of FIG. 7, taken across section line 8-8 inFIG. 7 and further shows a MOSFET die in the depression in the uppercopper layer of the DBC wafer.

FIG. 9 is a cross section of the package of the invention, like that ofFIG. 2, but further containing solder stop dimples to position the dieduring solder reflow.

FIG. 10 is a top view of FIG. 9.

FIG. 11 is an exploded perspective of the package of FIG. 9 with pluralresistive shunt vias in the DBC wafer.

FIG. 12 shows a DBC card in which the packages of the invention can beprocessed in wafer scale and can be singulated individually or inselected groups.

FIG. 13 shows an assembly of plural packages on a common heat sink withan upper heat sink as well.

FIG. 14 shows a assembly like that of FIG. 13 in which adjacent packagesshare a common central insulation layer of the DBC.

FIG. 15 shows an assembly of at least two packages with resistive viashunts and with metal interface terminals for the package.

FIG. 16 shows an assembly similar to that of FIG. 13 in which an EMIscreening plate is atop the package and one device has a resistiveshunt.

FIG. 17 shows an assembly like that of FIG. 16 with control integratedcircuits (ICs) mounted atop the individual devices.

FIG. 18 shows an assembly with packaged ICs fixed to the tops of thepower devices.

FIG. 19 shows a still further assembly of the novel packages of theinvention with an IC common to the two devices.

FIG. 20 shows a further assembly in which an IC contracts both the topand bottom contacts of a power device with a resistive via shunt.

FIG. 21 shows a novel assembly of the invention with a circuit boardmounted atop and connected to the power devices.

FIG. 22 shows a novel assembly in accordance with the invention with anEMI screen, a “smart” circuit board and a plastic molded body.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIGS. 1, 2 and 3 show a first embodiment of the semiconductor device 30of the invention. The semiconductor device 30 comprises a semiconductordie 31 and a housing 32.

Semiconductor die 31 may be a silicon based vertical conduction powerMOSFET having, on one surface, a source electrode which receives asolder bump 33, a gate electrode which receives a solder bump 34 and, onits opposite surface, a drain electrode which receives solder preform35. It should be noted that solderable metal pads can be used in placeof the solder bumps and solder paste can be used in place of the solderpreform. While die 31 is shown as a silicon die, it may be of any typeof semiconductor material including Gallium Nitride based devices,silicon carbide devices and the like. Further, while die 31 is describedas a power MOSFET, it can be any type of semiconductor device, includinga bipolar transistor die, an IGBT (lie, a break over device die, a diodedie and the like. The term MOSgated device is intended to refer to anytype of semiconductor switching device with power electrodes on at leastone surface thereof and a gate to switch the device between on and offconditions. The terms source electrode or source contact are intended toidentify the source of a MOSFET or the emitter of any IGBT. Similarly,the terms drain electrode or contact and collector electrode or contactare intended to be interchangably used.

The housing 32 used with the invention may be a wafer consisting of abottom conductive layer 40 which is bonded to an insulation layer 41 atits bottom surface, and a top conductive layer 43 which is bonded to theinsulation layer at its top. This type of structure is referred to as“DBC”. In accordance with the invention, top conductive layer 43 ispatterned to have a depression 50 etched or otherwise formed therein andhaving a flat bottom surface 51 at least partly surrounded by a rim 52.The surfaces of depression 51 and rim 52 may be plated, for example,nickel plated to optimize solder wetting and to passivate the canagainst oxidation, and to increase reliability by changing theintermetallic between solder and the copper and the silicon or othermaterial of the die to be soldered to surface 51.

The conductive materials used for conductive layers 40 and 43 may be anyhigh conductivity metal, such as, and preferably copper, although othermetals can be used. The center layer 41 may be any good electricalinsulation to insulate lavers 40 and 43 from one another and could be aceramic, preferably Al₂O₃. As further examples, AlN and SiN may also beused. The layers 40 and 43 may be of any desired thickness, typically300 μm but can have any other desired thickness, typically between 300to 600 μm. Such DBC materials are commercially available and arecommonly used in semiconductor device modules where copper layers 40 and43 are to be electrically insulated, but in thermal communication soheat generated in one layer can flow through the insulation barrier 41to the other conductive layer.

In accordance with the invention, the depression 51 will have a depthsufficient to receive solder layer 35 which typically may be less thanabout 100 μm thick and die 31 which typically may be thinned to lessthan about 100 μm. In the example of FIG. 1, the die is 70 μm thick andthe solder 35 is about 100 mm thick, leaving a web of copper 130 μmthick between surface 51 and the top surface of insulation layer 41.

Die 31 is appropriately soldered to the surface 50 of depression 50 withthe top surface of die 31 at least approximately coplanar with the topof rim 52. Solder bumps 33 and 34 project above this plane so that thepackage can be inverted and the contact bumps soldered to traces on acircuit board without need for wire bonds. Alternatively, solderablepads can be used in place of the solder bumps for later solder attach.Heat generated at die 31 during its operation is conducted throughceramic 41 to the copper layer 40 which can dissipate heat from thepackage and, in particular, can be thermally connected to a heat sinkwhich will be electrically insulated from the drain 35 and conductivelayer 40.

While a relatively large gap is shown between the outer periphery of die31 and the inner surface of rim 52, this space can be reduced to thesmallest dimension consistent with manufacturing ease and convenience.Further, the remaining gap may be tilled with an insulation bead.

FIG. 3 schematically shows two other possibly orientations for die 31 atlocations 3A and 3B.

The rim 52 of copper layer 43 is shown to be a horse shoe or U-shape inFIGS. 1, 2 and 3. Other configurations can be used. For example, in FIG.4, where, components similar to those of FIGS. 1, 2 and 3 have the sameidentifying numerals, the depression 51 in layer 43 is completelyenclosed by a rim 50. FIG. 4A shows another embodiment in which bothends of the rim 43 are removed or opened to simplify contact to the gateand source contacts 34 and 33 respectively. Further, in the embodimentof FIG. 4A, air inclusion is less likely to occur during molding or gelfilling.

FIGS. 5 and 6 show another embodiment of the invention and as will bethe case hereinafter with all drawings, the same number identifiessimilar components. FIGS. 5 and 6 show the die 31 of FIGS. 1 to 4flipped over so that the source and gate bumps (or the equivalent bumpsof an IGBT or the like) face the depressed flat surface 51. Thus, inFIGS. 5 and 6, the upper copper layer 43 of FIGS. 1 to 4 is separatedinto segments 43 a and 43 b with respective rim segments 52 a and 52 band flat depression base portions 51 a and 51 b. A short tongue 65extends from depression body 51 b. The flipped die 31 may then hesoldered with source bump 33 soldered to surface 51 a and gate bump 34soldered to surface 51 b and insulted from source bump 33 by the gap 66in top conductive layer 43 a-43 b.

FIGS. 7 and 8 show a further embodiment of the invention in which atleast one resistive current shunt is formed in package 70 (FIG. 8).Thus, the insulation layer 41 in FIG. 7 has a thru-opening 71 drilled orotherwise formed before copper layers 40 and 43 are bonded thereto. Thethru-opening 71 can also be formed after the layers 40 and 43 are bondedto insulation 41. A suitable electrically conductive material 72 (FIG.8) then fills the opening 71 to connect layers 40 and 43 and to formshunt resistor.

The required shunt resistance depends on the application and can besized at greater than about desired 0.1 mohm although any resistancevalue can be created. The value of the shunt resistance will be acompromise between the acceptable power loss within the shunt and thevoltage drop 73 across the shunt resistor 72. Note that the shunt 72 isintegrated into the thermal path of the package 70 and will beautomatically cooled by the heat sink or other thermal managementcooling for the die 31.

The resistance of shunt 72 will depend on the geometry and length ofthen hole 71 and the resistivity of the shunt material 72. The hole 71is shown with a circular cross-section, but it could have any othershape. Its length will be that of the thickness of insulation layer,which, when a ceramic such as Al₂O₃ will be from 300 μm to 600 μm.

The material used for shunt 72 may be any desired conductor, forexample, copper or solder, or may be materials such as manganin whichhave a relatively lower thermal coefficient of resistance. Pluralparallel shunts equally or symmetrically distributed over the surface ofthe insulation layer 21 may also be used, shown in FIG. 7 by dottedcircles 72 a, 72 b, 72 c which will be under the relevant die electrode.This offers the advantage of lower inductance, higher shunt current andmore equal shunt current distribution.

Referring next to FIGS. 9, 10 and 11, there is shown a solder stopstructure which securely locates the die 31 on surface 51 of device orpackage 70 of FIG. 8 during die attach and prevents the die edge fromcontacting the frame 52. Thus, a plurality of depressions or dimples 80are formed around the desired location of die 31 to self-align the dieduring the die attach reflow process. Dimples 80 preferably have therounded bottom shape reaching down to the ceramic 41.

It is also possible to use an isolating lacquer or other solder stopinside the frame 52. A “smooth solder” process may be used, using thepreform 35 as shown rather than a solder paste with flux, which can alsobe used. When using the solder preform 35; the solder process can becarried out in forming gas atmosphere to avoid strong movement of thedie inside the DBC can during the soldering process. However, dimples 80will act as solder stops and also provide stress release inside the canfor the bond force between the copper and the ceramic during temperaturecycling.

In order to minimize package costs, the individual packages 70 of FIG. 8(or 30 of FIG. 1) can be formed simultaneously on a DBC card and thensingulated from the card. Thus, a DBC card 90 is shown in FIG. 12. Suchcards are produced in sizes such as 5″×7″ or 4″×6″ and have a continuouscentral ceramic layer 41 with top and bottom copper layers. These layerscan be simultaneously masked and etched to define the individualpackages 70 (or 30) with the depressions 52 in the top layer as in theprior figures; and with other features such as the shunts 72 and dimples80 (FIGS. 9 and 10). After the patterning of the packages and thestreets 95 between the packages, various die 31 can be loaded into thepackages locations. Note that the shunts can be tested before die 31 areassembled and soldered in place, and each package can be tested beforesingulation of the packages. Further, the die loaded into the packagesmay be diverse die such as combination of MOSFETs, IGBTs, diodes and thelike.

It is very desirable to test the shunt 72 values before any silicon orother die is mounted in the respective package to reduce yield loss.After tests are carried out at wafer level, the DBC cans can besingulated by sawing, dicing or physically breaking at the streets 95.

Note that the packages can be singulated in clusters of two or morepackages. Two package clusters are shown on the right hand half of FIG.12 and may be mounted as will be described in connection with FIG. 14.

Note also that vias may be omitted in selected package locations on thecard 12, and in selected ones of a cluster of packages.

The formation of the packages on card 90 has benefits in connection withthe shipment of packages to a customer. Thus, the cards can be shippedto a customer intact and singulated by the user at the user's site. Thecards can be protected by a suitable foil for shipment and can bepre-scribed for easy break-off or singulation of packages by the enduser.

FIGS. 13, 14, 15, 16, 17, 18, 19, 20, 21 and 22 show variousapplications of packages 30 and 70 in multidevice packages includingtheir the inclusion of integrated circuits for current control.

Referring first to FIG. 13, there is shown a bottom DBC substrate 110having an upper patterned conductive layer 111, a bottom conductivelayer 112 and a thermally conductive ceramic insulation layer 113. Thebottom conductive layer 112 of DBC support 110 may be soldered by solder121 or otherwise adhesively connected to a massive heat sink 120 whichmay be a water cooled massive copper block. The ceramic layer 113electrically insulates the patterned conductive layer 111 from heat sink120. Note that DBC 110 can be replaced by an IMS (Insulated MetalSubstrate) structure.

The conductive pattern 111 on DBC 110 receives packages 30 as shown. Theconductors 43 are soldered to pattern 111 by solder layers 130 andsource bumps 33 are soldered to the pattern as shown. The gate bumps aresoldered to insulated patterned lands on pattern 111 in locations notseen in FIG. 13. The pattern 111 then interconnects the two packages 30as desired to define the desired circuit, such as a half bridge or thelike.

A further conductive heat sink or plate 131 may be attached by solder ora conductive adhesive glue to the conductive segments of devices 30 toprovide additional double-sided cooling for devices 30. The conductiveplate 131 is electrically insulated from devices 30 by the insulationlayers 31.

FIG. 14 shows an assembly like that of FIG. 13, where however, a cluster140 of two devices 30 with a common ceramic layer 141 are mounted onpatterned conductor 111. The cluster 140 may be that shown, for example,in FIG. 12 at the bottom right of the Figure, with or without the shunts72.

FIG. 15 shows the assembly of devices 70 of FIG. 8 with shunts 72mounted in the manner of FIG. 13 for devices 30. FIG. 15 shows the useof an external bus bar or lead frame including terminals 150 and 151connected to copper layer 40 of left hand device 70 and to the patternedconductor 11 respectively. Terminals 150 and 151 can provide terminalsfor connection to external circuits and terminal 150 can form a secondlevel of circuitry for mounting DC bus capacitors or other componentsneeded for switching applications such as inverters and the like.Terminals 150 and 151 can be angled as desired or can be straightconductors and extend out beyond the boundary of the DBC 110. Smallersignal connectors may also be provided for connecting the gates ofdevices 31 to a driver IC or to establish connections to sensors such astemperature, voltage and current sensors on the patterned conductor 111.

FIG. 16 shows an assembly like that of FIGS. 13 and 15 in which devices70 and 30 are mounted on DBC 110. FIG. 16 also shows an added coppercontact 150 and a metal plate 151 with a solder layer 152 to solder theplate 151 to conductors 40 and 150, and thus to patterned conductor 111.Plate 151 acts as an EMI screening plate reducing the need for anadditional EMI filter network which is important in automotiveapplications. Plate 151 also acts as an upper heat sink to packages 30and 70.

FIG. 17 shows the package of FIG. 16, in which a schematically shown ICdie 160 is mounted atop device 70 as by solder 161 and is wire bonded tothe die 31 in device 70 by wire bonds 162, 163 over conductive traces(not shown). Another control IC die 170 having ball contacts 171 ismounted atop device 30 and is connected to die 131 by traces, again notshown. ICs 160 and 170 may be of any desired type such as gate drivers,motor drivers, motion control ICs, I/O communication ICs and the like,up to microcontroller functions. The trace connections can be formed byvias through insulation layers 41. More specifically, IC die 160 isback-side soldered to conductor 40 by solder 161 and are then wirebonded to the die 31. Bare IC 170 is flip-chip soldered to the top ofdevice 30 which will have a suitable structured pattern to match theball grid array of IC 170.

FIG. 18 shows an assembly like that of FIG. 17 with two devices 30 inwhich prepackaged ICs ISO and 181 are used instead of the bare die 160and 170 respectively in FIG. 17. Via feed thrus, not shown, can be usedto make connections to the die 31 from ICs 180 and 181.

FIG. 19 shows the assembly of FIG. 14 with a packaged IC 190 soldered tothe two DBC cans in composite 140. The surfaces of copper layers 40 willbe suitably patterned to match and receive the plural IC terminals 191,192 (only two shown).

FIG. 20 shows a device assembly for a single device 72 in which an IC200 is connected to the patterned top of conductive layer 40 and to aconductor 201 which is connected to conductive pattern 111. An externalinterface terminal 202 is soldered to layer 40 by solder 203 and canreceive other external elements. This arrangement permits the IC 200 tomeasure the voltage drop on shunt 72 and feed and control a suitablepredictive circuit, not shown.

FIG. 21 shows the structure of FIG. 17 in which a circuit 210 boardcontaining active passive components for control of the power devices 31fixed atop conductors 40 by solder or adhesive glue 211 and electricallyconnected to pads (not shown) layers 40 to analyze the currents andvoltages in die 31 and initiate suitable control functions. A contact212 soldered to pattern 111 is also connected to the smart board 210.

FIG. 22 shows an assembly like that of FIG. 21 in which an EMI screeningplate 220 is added as shown, and external power terminals 221, 222 arcalso added.

Significantly, a mold compound 230 is added to encapsulate the package.A similar mold compound can be applied to the other assembliespreviously described.

Although the present invention has been described in relation toparticular embodiments thereof, many other variations and modificationsand other uses will become apparent to those skilled in the art. it ispreferred, therefore, that the present invention be limited not by thespecific disclosure herein.

1-88. (canceled)
 89. A semiconductor package comprising: a conductive layer over an insulation layer; a semiconductor die mounted on said conductive layer and having an electrode electrically connected to said conductive layer; a current sense resistor situated in an opening in said insulation layer, said current sense resistor electrically connected to said conductive layer.
 90. The semiconductor package of claim 89, wherein said current sense resistor fills said opening in said insulation layer.
 91. The semiconductor package of claim 89, wherein said electrode comprises a drain electrode of said semiconductor die.
 92. The semiconductor package of claim 89, wherein said current sense resistor comprises a plurality of parallel shunts distributed in said insulation layer.
 93. The semiconductor package of claim 89, wherein said conductive layer comprises a depression and said semiconductor die is situated in said depression.
 94. The semiconductor package of claim 89, wherein said insulation layer comprises a ceramic material.
 95. The semiconductor package of claim 89, further comprising a plurality of solder stop dimples formed in said conductive layer around said semiconductor die.
 96. The semiconductor package of claim 95, wherein said solder stop dimples have a rounded bottom shape.
 97. A semiconductor package comprising: a conductive layer over an insulation layer; a semiconductor die mounted on said conductive layer and having an electrode electrically connected to said conductive layer; a current sense resistor situated in said insulation layer, said current sense resistor electrically connected to said conductive layer; at least one via in said insulation layer, wherein said current sense resistor comprises resistive material situated in said at least one via.
 98. The semiconductor package of claim 97, wherein said current sense resistor fills said at least one via in said insulation layer.
 99. The semiconductor package of claim 97, wherein said electrode comprises a drain electrode of said semiconductor die.
 100. The semiconductor package of claim 97, wherein said current sense resistor comprises a plurality of parallel shunts distributed in said insulation layer.
 101. The semiconductor package of claim 97, wherein said conductive layer comprises a depression and said semiconductor die is situated in said depression.
 102. The semiconductor package of claim 97, wherein said insulation layer comprises a ceramic material.
 103. The semiconductor package of claim 97, further comprising a plurality of solder stop dimples formed in said conductive layer around said semiconductor die.
 104. The semiconductor package of claim 103, wherein said solder stop dimples have a rounded bottom shape. 